HCLTech partners with Samsung Foundry to advance semiconductor technology

Technology company HCLTech has been selected as a Design Solution Partner (DSP) under the Samsung Advanced Foundry Ecosystem (SAFE) program. This partnership aims to enhance semiconductor technology by combining HCLTech’s expertise in engineering and research with Samsung’s advanced foundry technology. 

Under the SAFE-DSP program, HCLTech will provide application-specific integrated circuit (ASIC) design services to customers using Samsung’s semiconductor manufacturing processes. The collaboration will support efficient chip design and development. 

As part of the agreement, Samsung will offer training to HCLTech employees on advanced semiconductor technologies. The company will also provide technical support for turnkey projects and enable better access to wafers through Multi-Project Wafer (MPW) programs, which help in prototyping and production. 

"By leveraging the strengths of both HCLTech and Samsung Foundry, we aim to drive advancements in semiconductor technology and meet the changing demands of the global market," said Sanjay Gupta, Corporate Vice President of North Asia at HCLTech. 

In addition to this the company was also selected by Samsung Foundry to join its Virtual Design Partner (VDP) program on in December last year. This program aims to accelerate semiconductor technology development by integrating design and manufacturing expertise. Through HCLTech's 'spec-to-platform' methodology, the partnership focuses on advancing system-on-chip (SoC) development and delivering custom silicon solutions across various industries.