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CDIL, Infineon partner to build chips for e-mobility, renewable energy sectors

CDIL, Infineon partner to build chips for e-mobility, renewable energy sectors
Photo Credit: Pixabay
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Semiconductor chip and device manufacture CDIL Semiconductors has partnered with Infineon Technologies Asia Pacific, a part of Germany-based Infineon Technologies AG. The two companies have signed a memorandum of understanding to collaborate in India’s fast-growing semiconductor market.

Under this partnership, Infineon will supply high-performance bare die wafers to CDIL, which will package them into discrete and module semiconductor products tailored for Indian customers. This partnership will facilitate next-generation vehicle electronics, and electrification, deliver high-efficiency solutions for solar, wind, and power management applications, and enhance smart applications.

“By integrating Infineon’s world-class wafer technology with CDIL’s advanced OSAT capabilities, we are setting new benchmarks in innovation and localisation. This collaboration goes beyond growth—it drives innovation, accelerates ‘Make in India,’ and positions India as a hub for semiconductor excellence,” said Pankaj Gulati, President, CDIL.

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The two parties aim to strengthen India’s domestic capabilities and global supply chain position by providing high-performance, reliable, and energy-efficient solutions with significantly reduced lead times, they said in a joint statement.

“We are excited to partner up with CDIL to drive growth and innovation in India's semiconductor ecosystem. Through this collaboration, we will be delivering cutting-edge power semiconductor products and solutions to customers that address the growing needs in e-mobility, renewable energy, and energy-efficient appliances in India,” said Richard Kuncic, Senior Vice President & General Manager Power Systems at Infineon Technologies.

To be sure, Mohali-based CDIL Semiconductors announced in 2023 that it will adding new semiconductor packaging lines via the IT ministry’s Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS). The company had then said that it is looking at bolstering annual capacity by 100 million units with the new lines.

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