Honeywell to leverage NXP Semiconductor’s offerings to optimise building technology system

Honeywell has signed a memorandum of understanding (MoU) with US chipmaker NXP Semiconductor to optimise building technology systems. Under this partnership, NXP Semiconductors' neural network-enabled, industrial-grade applications processors will be integrated into Honeywell's building management systems (BMS).

The MoU will initially focus on the Honeywell Optimizer Suite, which offers a flexible, more future-proofed building control and automation platform, the company said in a press release. Honeywell anticipates that artificial intelligence (AI), machine learning (ML), and data science-powered smart energy solutions will drive efficiency and guide service technicians. 

"Buildings are increasingly relying on data and the ability to control operations via automation to make them more sustainable while operating more efficiently," said Suresh Venkatarayalu, Honeywell's chief technology officer. "NXP's latest machine learning solutions will help us deliver excellence in building automation for our customers."

The ultimate goal would be ‘fully-leverage’ NXP's neural network-enabled i.MX chipset capabilities to further enhance Honeywell's BMS product offerings. Honeywell will build on NXP's i.MX 8M applications processors and i.MX RT crossover microcontrollers, to enhance analytics and decision-making in the same on-site BMS equipment that manages critical building systems. 

"NXP's advanced portfolio of securely connected processing solutions are supported by easy-to-use tools for rapid AI model development and service platform for provisioning and managing Internet of Things (IoT) devices throughout the long building management lifecycle. This capability, combined with Honeywell's expertise as one of the leading building management solution providers, marks an important milestone in our shared vision to enable a smarter, more connected world for all,” said Lars Reger, NXP Semiconductors' chief technology officer.